Designation:B32–04
Standard Specification for
Solder Metal1
This standard is issued under thefixed designation B32;the number immediately following the designation indicates the year of original adoption or,in the case of revision,the year of last revision.A number in parentheses indicates the year of last reapproval.A superscript epsilon(e)indicates an editorial change since the last revision or reapproval.
This standard has been approved for use by agencies of the Department of Defense.
1.Scope
1.1This specification covers solder metal alloys(commonly known as soft solders)used in non-electronic applications, including but not limited to,tin-lead,tin-antimony,tin-antimony-copper-silver,tin-antimony-copper-silver-nickel,tin-silver,tin-copper-silver,and lead-tin-silver,used for the pur-pose of joining together two or more metals at temperatures below their melting points.Electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications are not covered by this specification as they are under the auspices of IPC–Association Connecting Electronic Industries.
1.1.1These solders include those alloys having a liquidus temperature not exceeding800°F(430°C).
1.1.2This specification includes solders in the form of solid bars,ingots,powder and special forms,and in the form of solid andflux-core ribbon,wire,and solder paste.
1.2The values stated in inch-pound units are to be regarded as the standard.The values given in parentheses are for information only.
1.3This standard does not purport to address all of the safety concerns,if any,associated with its use.
It is the responsibility of the user of this standard to become familiar with all hazards including those identified in the appropriate Material Safety Data Sheet for this product/material as pro-vided by the manufacturer,to establish appropriate safety and health practices,and determine the applicability of regulatory limitations prior to use.
2.Referenced Documents
2.1ASTM Standards:2
D269Test Method for Insoluble Matter in Rosin and Rosin Derivatives企业供求 D464Test Methods for Saponification Number of Naval
Store Products Including Tall Oil and Other Related Products
D465Test Methods for Acid Number of Naval Stores Products Including Tall Oil and Other Related Products D509Test Methods of Sampling and Grading Rosin
E28Test Methods for Softening Point of Resins Derived from Naval Stores by Ring-and-Ball Apparatus
E29Practice for Using Significant Digits in Test Data to Determine Conformance with Specifications
E46Test Methods for Chemical Analysis of Lead-and Tin-Base Solder3
E51Method for Spectrographic Analysis of Tin Alloys by the Powder Technique3
E55Practice for Sampling Wrought Nonferrous Metals and Alloys for Determination of Chemical Composition
E87Methods for Chemical Analysis of Lead,Tin,Anti-mony,and Their Alloys(Photometric Method)3
E88Practice for Sampling Nonferrous Metals and Alloys in Cast Form for Determination of Chemical Composition 2.2Federal Standard:4
Fed.Std.No.123Marking for Shipment(Civil Agencies) 2.3Military Standard:5
MIL-STD-129Marking for Shipment and Storage
3.Terminology
3.1Definition:
3.1.1producer,n—the primary manufacturer of the mate-rial.
3.2Definitions of Terms Specific to This Standard:
3.2.1lot,n—The term“lot”as used in this specification is defined as follows:
3.2.1.1Discussion—For solid solder metal,a lot consists of all solder of the same type designation,produced from the same batch of raw materials under essentially the same conditions,and offered for inspection at one time.
3.2.1.2Discussion—Forflux–core solder,a lot consists of all solder of the same core mixture,produced from the same
1This specification is under the jurisdiction of ASTM Committee B02on Nonferrous Metals and Alloys and is the direct responsibility of Subcommittee B02.02on Refined Lead,Tin,Antimony,and Their Alloys.
Current edition approved Nov.1,2004.Published November2004.Originally
approved in1919.Last previous edition approved in2003as B32-03.
2For referenced ASTM standards,visit the ASTM website,,or contact ASTM Customer Service at For Annual Book of ASTM Standards volume information,refer to the standard’s Document Summary page on the ASTM website.
3Withdrawn.
4Available from Global Engineering Documents,15Inverness Way East, Englewood,CO80112.
5Available from Standardization Documents Order Desk,Bldg.4Section D,700 Robbins Ave.,Philadelphia,PA19111-5094,Attn:NPODS.
1
Copyright©ASTM International,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA19428-2959,United States.
batch of raw materials under essentially the same conditions and offered for inspection at one time.
3.2.2lot number,,n—The term“lot number”as used in this specification refers to an alphanumeric or numerical designa-tion for a lot which is traceable to a date of manufacture.
4.Classification
4.1Type Designation—The type designation uses the fol-lowing symbols to properly identify the material:
4.1.1Alloy Composition—The composition is identified by
a two-letter symbol and a number.The letters typically indicate the chemical symbol for the critical element in the solder and the number indicates the nominal percentage,by weight,of the critical element in the solder.The designation followed by the letters A or B distinguishes between different alloy grades of similar composition(see Table1).
4.1.2Form—The form is indicated by a single letter in accordance with Table2.
4.1.3Flux Type—Theflux type is indicated by a letter or combination of letters in accordance with Table3.
4.1.4Core Condition and Flux Percentage(applicable only toflux-cored solder)—The core condition andflux percentage is identified by a single letter and a number in accordance with Table4.
4.1.5Powder Mesh Size and Flux Percentage(applicable only to solder paste)—The powder mesh size andflux percent-age is identified by a single letter and a number in accordance with Table
5.
5.Ordering Information
5.1Orders for material under this specification indicate the following information,as required,to adequately describe the desired material.
5.1.1Type designation(see4.1),
知识与
能力训练5.1.2Detailed requirements for special forms, 5.1.3Dimensions of ribbon and wire solder(see9.2),
5.1.4Unit weight,
5.1.5Packaging(see Section18),
5.1.6Marking(see Section17),
5.1.7ASTM specification number and issue,marked on(a) purchase order and(b)package or spool,and
5.1.8Special requirements,as agreed upon between sup-plier and purchaser.
6.Materials and Manufacture
6.1The producer must have each lot of solder metal as uniform in quality as practicable and of satisfactory appearance in accordance with best industrial practices.Each bar,ingot,or other form in which the solder is sold must be uniform in composition with the entire lot.
7.Chemical Composition
7.1Solder Alloy—The solder alloy composition is as speci-fied in Table1.
N OTE1—By mutual agreement between supplier and purchaser,analy-sis may be required and limits established for elements or compounds not specified in Table1.
7.2Flux(applicable toflux-core ribbon,wire,and solder paste):
单身贵族俱乐部
7.2.1Type R—Theflux is composed of Grade WW or WG gum rosin of Test Methods D509.The rosin shall have a toluene–insoluble matter content of not more than0.05 weight%in accordance with Test Method D269,a minimum acid number of160mg KOH/1g sample in accordance with Test Methods D465,a minimum softening point of70°C in accordance with Test Methods E28,and a minimum saponi-fication number of166in accordance with Test Methods D464.When solvents or plasticizers are added,they must be nonchlorinated.
7.2.2Type RMA—Theflux is composed of rosin conform-ing to7.2.1.Incorporated additives provide a material meeting the requirements of8.1.2for type RMA.When solvents or plasticizers are added,they must be nonchlorinated.
7.2.3Type RA—Theflux is composed of rosin conforming to7.2.1.Incorporated additives provide a material meeting the requirements of8.1.2for Type RA.When solvents or plasti-cizers are added,they must be nonchlorinated.
7.2.4Type OA—Theflux is composed of one or more water-soluble organic materials.
7.2.5Type OS—Theflux is composed of one or more water-insoluble organic materials,other than Types R,RMA, and RA,which are soluble in organic solvents.
7.2.6Type IS—Theflux is composed of one or more inorganic salts or acids with or without an organic binder and solvents.
8.Physical Properties and Performance Requirements 8.1Solder Paste—Solder paste must exhibit smoothness of texture(no lumps)and the absence of caking and drying. 8.1.1Powder Mesh Size—The solder powder mesh size shall be as specified(see5.1.1and4.1.5)when the extracted solder powder is tested as specified in13.4.
8.1.2Viscosity—The viscosity of solder paste and the method used to determine the viscosity must be agreed upon between the supplier and purchaser.The following variables must be taken into account when relating one viscosity measurement to another type of viscometer used,spindle size and shape,speed(r/min),temperature of sample,and the use or non-use of a helipath.
8.2Requirements for Flux—Theflux must meet the physi-cal and performance requirements specified in Table6as applicable.
8.2.1Solder Pool—When solder is tested as specified in 13.3.2,there must be no spattering,as indicated by the presence offlux particles outside the main pool of residue.The flux must promote spreading of the molten solder over the coupon to form integrally thereon a coat of solder that shall f
eather out to a thin edge.The complete edge of the solder pool must be clearly visible through theflux residue.
8.2.2Dryness—When solder is tested as specified in13.3.2, the surface of the residue must be free of tackiness,permitting easy and complete removal of applied powdered chalk.
8.2.3Chlorides and Bromides Test—When the extracted flux is tested as specified in13.3.6,the test paper will show no chlorides or bromides by a color change of the paper to off-white or yellow white.
8.2.4Copper Mirror Test—When tested as specified in 13.3.7,the extractedflux will have failed the test if,
when
T A B L E 1S o l d e r C o m p o s i t i o n s -w t %(r a n g e o r m a x i m u m )
C o m p o s i t i o n ,%A
M e l t i n g R a n g e B
A l l o y G r a d e
S n 1P b 2S b 3
A g 4
C u 5C d 6A l 7B i 8A s 9F e 10Z n 11N i 12C e 13S e 14S o l i d u s L i q u i d u s U N S N u m b e r °F
°C °F °C
S e c t i o n 1:S o l d e r A l l o y s C o n t a i n i n g L e s s t h a n 0.2%L e a d C
S n 96R e m 0.100.12
3.4–3.8
0.080.0050.0050.150.05m a x 0.020.005 (430)
221430221
L 13965
ifcS n 95R e m 0.100.124.4–4.80.080.0050.0050.150.050.
...430221473245L 13967
S n 94R e m 0.100.125.4–5.80.080.0050.0050.150.050..430221536280L 13969S b 594.0m i n 0.204.5-5.50.0150.080.0050.0050.150.050..450233464240L 13950E D
R e m 0.100.050.25–0.753.0–5.00.0050.0050.020.050..440225660349L 13935H A D
R e m 0.100.5–4.00.1–3.00.1–2.00.0050.0050.150.050.020.5–.420216440227L 13955H B D
R e m 0.104.0–6.00.05–0.52.0–5.00.0050.0050.150.050.020.010.05–460238660349L 13952H N D
R e m 0.100.050.05–0.153.5–4.50.0050.0050.150.050.020.0050.440225660350L 13933
P T D R e m 0.20.25–4.0
0.05–0.50
0.25–4.00.0050.0050.150.01
0.020.0050.0050.01–
430
221435224
A C D
R e m 0.100.050.2–0.3
0.1–0.30.0050.0052.75–3.750.050.020.
...
403
206
453
234
L 13964
O A D
R e m 0.20.050.05–0.32.0–4.00.0050.0050.5–1.50.050.04†.420216460238L 13937A M R e m 0.100.8–1.20.4–0.62.8–3.20.0050.0050.150.050..430220446230L 13938T C R e m 0.200.05
0.015
4.0–
5.00.0050.0050.05
0.050.040.0.04–0.20419
215
660
350
L 13931
W S R e m 0.101.0–1.5
0.2–0.6
3.5–
4.50.0050.0050.020.050.020.00
<
...
440
225
660
350
L 13939
S e c t i o n 2:S o l d e r A l l o y s C o n t a i n i n g L e a d S n 7069.5–71.5R e m 0.500.0150.080.0010.0050.250.030..361183377193L 13700S n 6362.5–63.5R e m 0.500.0150.080.0010.0050.250.030..361183361183L 13630S n 6261.5–62.5R e m 0.501.75–2.250.080.0010.0050.250.030..354179372189L 13620S n 6059.5–61.5R e m 0.500.0150.080.0010.0050.250.030..361183374190L 13600S n 5049.5–51.5R e m 0.500.0150.080.0010.0050.250.0250..361183421216L 55031S n 4544.5–46.5R e m 0.500.0150.080.0010.0050.250.0250..361183441227L 54951S n 40A 39.5–41.5R e m 0.500.0150.080.0010.0050.250.020..361183460238L 54916S n 40B 39.5–41.5R e m 1.8–2.40.0150.080.0010.0050.250.020..365185448231L 54918S n 35A 34.5–36.5R e m 0.500.0150.080.0010.0050.250.020..361183447247L 54851S n 35B 34.5–36.5R e m 1.6–2.00.0150.080.0010.0050.250.020..365185470243L 54852S n 30A 29.5–31.5R e m 0.500.0150.080.0010.0050.250.020..361183491255L 54821S n 30B 29.5–31.5R e m
1.4–1.80.0150.080.0010.0050.250.020..365185482250L 54822S n 25A 24.5–26.5R e m 0.500.0150.080.0010.0050.250.020..361183511266L 54721S n 25B 24.5–26.5R e m 1.1–1.50.0150.080.0010.0050.250.020..365185504263L 54722S n 20A 19.5–21.5R e m 0.500.0150.080.0010.0050.250.020..361183531277L 54711S n 20B 19.5–21.5R e m 0.8–1.20.0150.080.0010.0050.250.020..363184517270L 54712S n 1514.5–16.5R e m 0.500.0150.080.0010.0050.250.020..437225554290L 54560S n 10A 9.0–11.0R e m 0.500.0150.080.0010.0050.250.020..514268576302L 54520S n 10B 9.0–11.0R e m 0.201.7–2.40.080.0010.0050.030.020..514268570299L 54525S n 54.5–5.5R e m 0.500.0150.080.0010.0050.250.020..586308594312L 54322S n 21.5–2.5R e m 0.500.0150.080.0010.0050.250.020..601316611322L 54210A g 1.50.75–1.25R e m 0.401.3–1.70.300.0010.0050.250.020..588309588309L 50132A g 2.50.25R e m 0.402.3–2.70.300.0010.0050.250.020..580304580304L 50151A g 5.50.25R e m 0.40
5.0–
6.00.300.0010.0050.250.020.02
0.005 (580)
304
716
380
L 50180
A
F o r p u r p o s e s o f d e t e r m i n i n g c o n f o r m a n c e t o t h e s e l i m i t s ,a n o b s e r v e d v a l u e o r c a l c u l a t e d v a l u e o b t a i n e d f r o m a n a l y s i s s h a l l b e r o u n d e d t o t h e n e a r e s t u n i t i n t h e l a s t r i g h t -h a n d p l a c e o f fig u r e s u s e d i n e x p r e s s i n g
t h e s p e c i fie d l i m i t ,i n a c c o r d a n c e w i t h t h e r o u n d i n g m e t h o d o f P r a c t i c e E 29.B T e m p e r a t u r e s g i v e n a r e a p p r o x i m a t i o n s a n d f o r i n f o r m a t i o n o n l y .C F o r a l l o y s n o t i d e n t i fie d ,n a m e d e l e m e n t s s h a l l c o n f o r m t o t h e f o l l o w i n g t o l e r a n c e s (w t %):>5%60.5%,>=5%60.25%;I m p u r i t y e l e m e n t s (m a x i m u m ):S n -0.2,P b -0.2,S b -0.5,A g -0.015,C u -0.08,C d -0.005,A l -0.05,B i -0.15,A s -0.02,F e -0.02,Z n -0.005.D G r a d e s E a n d O A a r e c o v e r e d b y U .S .p a t e n t s h e l d b y E n g e l h a r d C
o r p ,M a n s fie l d ,M A ,a n d O a t e y C o .C l e v e l a n d ,O H r e s p e c t i v e l y .F e d e r a t e d F r y M e t a l s ,A l t o o n a ,P A a n d T a r a c o r p I n c .,A t l a n t a ,G A h a v e a p p l i e d f o r p a t e n t s o n g r a d e s A C a n d T C r e s p e c t i v e l y .G r a d e s H A ,H B ,a n d H N a r e c o v e r e d b y p a t e n t s a s s i g n e d t o J .W .H a r r i s C o .,C i n c i n n a t i ,O H .G r a d e P T i s c o v e r e d b y a p a t e n t i s s u e d t o P r e c i s e A l l o y s C o r p o r a t i o n ,B r o n x ,N Y .I n t e r e s t e d p a r t i e s a r e i n v i t e d t o s u b m i t i n f o r m a t i o n r e g a r d i n g i d e n t i fic a t i o n o f a c c e p t a b l e a l t e r n a t i v e s t o t h e s e p a t e n t e d i t e m s t o t h e C o m m i t t e e o n S t a n d a r d s ,A S T M I n t e r n a t i o n a l H e a d q u a r t e r s ,100B a r r H a r b o r D r i v e ,W e s t C o n s h o h o c k e n ,P A 19428.Y o u r c o m m e n t s w i l l r e c e i v e c a r e f u l c o n s i d e r a t i o n a t a m e e t i n g o f t h e r e s p o n s i b l e t e c h n i c a l c o m m i t t e e 1,w h i c h y o u m a y a t t e n d .
†O A v a l u e f o r F e 10w a s c o r r e c t e d e d i t o r i a l l y
.
examined against a white background,complete removal of the copper film is noted,as evidenced by the white background showing through,and must be rejected.Discoloration of the copper due to a superficial reaction or to only a partial reduction of the thickness of the copper film is not cause for rejection.
9.Dimensions and Unit Weight
9.1Bar and Ingot Solder —The dimensions and unit weight of bar and ingot solder will be as agreed upon between supplier and purchaser.
9.2Wire solder (solid and flux-cored)—The dimensions and unit weight of wire solder are specified in 5.1.3and 5.1.4.The
tolerance on the specified outside diameter shall be 65%or 60.002in.(0.05mm),whichever is greater.9.3Other Forms :
9.3.1Dimensions for ribbon and special forms will be agreed upon between supplier and purchaser.
9.3.2The unit weight of solder paste is specified in 5.1.4.10.Workmanship,Finish,and Appearance
北大校长跪母
10.1All forms of solder must be processed in such a manner as to be uniform in quality and free of defects that will affect life,serviceability,or appearance.
11.Sampling
11.1Care must be taken to ensure that the sample selected for testing is representative of the material.The method of sampling consists of one of the following methods:
11.1.1Samples taken from the final solidified cast or fabri-cated product.
11.1.2Representative samples obtained from the lot of molten metal during casting.The molten sample is poured into a cool mold,forming a bar approximately 1⁄4in.(6.4mm)thick.
11.2Frequency of Sampling —Frequency of sampling for determination of chemical composition shall be in accordance with Table 7.For spools and coils,the sample is obtained by cutting back 6ft (1.8m)of wire from the free end and then taking the next 6ft for test.In other forms,an equivalent sample is selected at random from the container.
11.3Other Aspects of Sampling —Other aspects of sampling conforms in the case of bar and ingots,to Practice E 88.For fabricated solders the appropriate reference is Practice E 55.12.Specime
n Preparation
12.1Flux-Cored Ribbon and Wire Solder and Solder Paste —Each sample of flux-cored ribbon or wire solder or solder paste is melted in a clean container under oil and mixed thoroughly.After the flux has risen to the top,the alloy is poured carefully into a cool mold (care should be taken to allow the flux and alloy to separate completely),forming a bar approximately 1⁄4in.(6.4mm)thick.The bar is cleaned of flux residue and sampled for analysis as specified in 12.3.12.1.1Flux Extraction Procedure :
12.1.1.1Flux-Cored Solder —The flux core is extracted as follows:Cut a length of the flux-cored solder weighing approximately 150g and seal the ends.Wipe the surface clean with a cloth moistened with acetone.Place the sample in a beaker,add sufficient distilled water to cover the sample,and boil for 5to 6min.Rinse the sample with acetone and allow to dry.Protecting the solder surface from contamination,cut the sample into 3⁄8in.(9.5mm)(maximum)lengths without crimping the cut ends.Place the cut lengths in an extraction tube of a chemically clean soxhlet extraction apparatus and extract the flux with reagent grade,99%isopropyl alcohol until the return condensate is clear.The resistivity of water extract,copper mirror,and chlorides and bromides tests are performed using a test solution prepared by concentrating the solids content in the flux extract solution to appro
ximately 35%by weight by evaporation of the excess solvent.The exact
TABLE 2Form
Symbol Form B Bar I Ingot P Powder R Ribbon S Special A W
Wire
A
Includes pellets,preforms,etc.
TABLE 3Flux Type
Symbol Description
S Solid,no flux
R Rosin,nonactivated RMA Rosin,mildly activated RA Rosin,activated
OA Organic,water-soluble
OS Organic,organic solvent-soluble (other than R,RMA,or RA)IS
Inorganic acids and salts
TABLE 4Core Condition and Flux Percentage
Condition Symbol
Condition D Dry powder P Plastic
Percentage Symbol
Flux Percentage by Weight
Nominal Min Max 1 1.10.8 1.52 2.2 1.6 2.63 3.3 2.7 3.94 4.5 4.0 5.06A
6.0 5.1
7.0
A
Not applicable to flux types R,RMA,and RA.
TABLE 5Powder Mesh Size and Flux Percentage
Size Symbol
Powder Mesh Size
A <325
B <200C
<100
Percentage Symbol
Flux Percentage by Weight
Min Max 115261031115416205212562630
7
>30
solids content of the test solution are determined on an aliquot, dried to constant weight in a circulating air oven maintained at 8563°C.
12.1.1.2Solder Paste—Theflux is extracted as follows: Place200mL of reagent grade,99%isopropyl alcohol in a chemically clean Erlenmeyerflask.Add4062g of solder paste to theflask,cover with a watch glass,and boil for10to 15min using medium heat.Allow the powder to settle for2to 3min and decant the hot solution into a funnel containingfilter paper,collecting theflux extract in a chemically clean vessel. N OTE2—The solution in isopropyl alcohol does not necessarily have to be clear.The resistivity of water extract and chlorides and bromides tests shall be performed using a test solution prepared by concentrating the solids content in theflux extract solution to approximately35%by weight by evaporation of the excess solvent.The exact solids content of the test solution shall be determined on an aliquot,dried to constant weight in a circulating air oven maintained at8563°C.
12.2Solid Ribbon and Wire Solder—Each sample of solid ribbon and wire solder is prepared in accordance with12.1,as applicable.
12.3Bar and Ingot Solder—Each sample piece is cut in half and one half marked and held in reserve.The remaining half is melted in a clean container,mixed thoroughly and poured into a cool mold,forming a bar approximately1⁄4in.(6.4mm) thick.Sampling is performed by one of the following methods: 12.3.1Sawing—Saw cuts are made across the bar at equal intervals of not more than1in.(2.5cm)throughout its length. If it is impractical to melt the bar or ingot as specified above, saw cuts are made across each piece at equal intervals of not more than1in.(2.5cm)throughout its length.No lubricants are used during sawing.The specimen consists of not less than 5oz(143g)of mixed sawings.
12.3.2Drilling—The bar is drilled at least halfway through from two opposite sides.A drill of about1⁄2in.(12.7mm)in diameter is preferred.In drilling,the holes are placed along a diagonal line from one corner of the pig to the other.The drillings are clipped into pieces not over1⁄2in.(12.7mm)in length and mixed thoroughly.The specimen consists of not less than5oz(143g).
13.Test Methods
13.1Visual and Dimensional Examination:
13.1.1Ribbon and Wire Solder(Solid and Flux-Cored)—Ribbon and wire solder must be examined to verify that the dimensions,unit weight,and workmanship are in accordance with the applicable requirements.
13.1.2Solder Paste—Solder paste must be examined for smoothness of texture(no lumps),caking,drying,unit weight, and workmanship in accordance with the applicable require-ments.
13.1.3Bar and Ingot Solder—Bar and ingot solder must be examined to verify that the unit weight,marking,and work-manship are in accordance with the applicable requirements.
13.2Alloy Composition—In case of dispute,the chemical analysis is made in accordance with Test Methods E46, Method E51,and Methods E87.
13.3Flux:
13.3.1Determination of Weight Percent of Flux:
13.3.1.1Select a minimum of20g offlux-core ribbon or wire or solder paste.Weigh the sample in a cle
an porcelain crucible determining the weight to the nearest0.01g.Heat until the solder is completely molten.Carefully stir the molten solder a few times to free any entrappedflux.Allow the solder to cool until it solidifies;clean thoroughly offlux residues and reweigh the solder.
13.3.1.2Calculation—Calculate the weight percent offlux as follows:
F5
C2S
C
3100(1)
where:
F=weight percent offlux,
C=initial weight of solder sample,g,and
pt100S=final weight of solder sample,g.
13.3.2Solder Pool(applicable only to composition60/ 40)—For each sample being tested,three coupons1.5in.(38 mm)square shall be cut from0.063in.(1.6mm)thick sheet copper.Forflux Type IA only,the coupons shall be cut from cold-rolled commercial sheet steel,approximately0.063in.
TABLE6Requirements for Flux
Test Type R Type RMA Type RA Other Flux Types Method Section Weight offlux see Table4see Table4see Table4see Table413.3.1 Solder pool A see8.2.1see8.2.1see8.2.1see8.2.113.3.2 Spread factor B80min80min80min not required13.3.3 Dryness C see8.2.2see8.2.2see8.2.2not required13.3.4 Resistivity of water extract
(V·cm)
100000min10000050000not required13.3.5 Chlorides and bromides D see8.2.3see8.2.3not required not required13.3.6 Copper mirror E pass pass not required not required13.3.7
A Applicable only to composition60/40.
B Applicable only to composition60/40in the form offlux-core wire or solderpaste.
C Applicable only to composition60/40in the form offlux-core wire.
D Applicable only toflux-core wire and solderpaste.
E Applicable only toflux-core wire.
TABLE7Frequency of Sampling
Size of Lot,lb(kg)Number of Samples(spools, coils,containers or pieces)
Up to1000(450),incl3 Over1000to10000(450to4500),incl5 Over10000(4500)
10
