专利名称：CHIP FINE LINE FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING
METHOD THEREFOR
发明人：YAN, Yingqiang，燕英强,WANG, Yao，王垚,HU, Chuan，胡川,XIANG, Xun，向迅,CHEN, Zhitao，陈
志涛
申请号：CN2020/104923微型显示器
矿泉水瓶盖申请日：20200727
公开号：WO2022/021018A1
公开日：
20220203
专利内容由知识产权出版社提供
接种棒专利附图：
摘要：Embodiments of the present application relate to the technical field of chips, and provide a chip fine line fan-out package structure and a manufacturing method therefor. The chip fine line fan-out package structure provided by the embodiments of the present application and the chip fine line fan-out package structure manufactured using the manufacturing method provided by the embodiments of the present application each comprise an inter-chip fine winding layer and a package winding layer. The line width and line spacing of the inter-chip fine winding layer are less than the line width and line spacing of the package winding layer, and therefore, a user can choose to use different package winding layers according to actual needs. Therefore, the chip fine line fan-out package structure provided by the present application and the package structure manufactured using the manufacturing method provided by the present application can meet the use demands of users in more scenarios.dibase
申请人：GUANGDONG INSTITUTE OF SEMICONDUCTOR INDUSTRIAL TECHNOLOGY，广东省半导体产业技术研究院 系船柱地址：363 Changxing Road, Tianhe District Guangzhou, Guangdong 510000，中国广东省广州市天河区长兴路363号, Guangdong 510000
国籍：CN,CN
代理人：CHOFN INTELLECTUAL PROPERTY，北京超凡宏宇专利代理事务所（特殊普通合伙）更多信息请下载全文后查看编织袋缝底机
